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| Manufacturer Part Number | XC7Z045-1FBG676I 伊顿盛电子专业供应商! 价格请以来电为准!更多物料查 询请来电.... |
|---|---|
| Description | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ System On Chip (SOC) IC Zynq®-7000 Kintex™-7 FPGA, 350K Logic Cells 256KB 667MHz 676-FCBGA (27x27) |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
| Manufacturer Standard Lead Time | 6 Weeks |

| Category | Integrated Circuits (ICs) | |
|---|---|---|
| Family | Embedded - System On Chip (SoC) | |
| Manufacturer | Xilinx Inc. | |
| Series | Zynq®-7000 | |
Packaging ![]() | Tray ![]() | |
| Part Status | Active | |
| Architecture | MCU, FPGA | |
| Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | |
| MCU Flash | - | |
| MCU RAM | 256KB | |
| Peripherals | DMA | |
| Connectivity | CAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |
| Speed | 667MHz | |
| Primary Attributes | Kintex™-7 FPGA, 350K Logic Cells | |
| Operating Temperature | -40°C ~ 100°C (TJ) | |
| Package / Case | 676-BBGA, FCBGA | |
| Supplier Device Package | 676-FCBGA (27x27) | |
| Number of I/O | 130 |